Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020
Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Electronics Forum | Wed Jan 15 12:10:22 EST 2020 | emeto
Avillaro, I don't have hands on experience with Vapor Phase equipment, but my guess is that it will work better for thick boards like yours. Trying another chemistry is a logical move. May be it is worth trying the fixture for connector flatness as n
Electronics Forum | Tue Jan 14 10:41:49 EST 2020 | robl
Hi Arnel, I've used these before but with a 0.005" stencil. The key issue here was that the pins are actually a solder preform at the base that melts into the board - sort of BGA like, so too much paste can cause issues. Samtec have some great app
Electronics Forum | Tue Jan 14 17:22:16 EST 2020 | emeto
Avillaro, would you say that vapor phase process was selected, because the boards are so thick and heavy? I would assume so. Have you ever tried to run them through reflow oven? To understand better your challenge, we need to understand the setup be
Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto
Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020
Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more
